ISCIT 2026 - Call For Papers
2026 The 25th
International Symposium on Communications and Information Technologies
July 28th-30th 2026, Qingdao, China
Hosted by
July 28-30, 2026 – Qingdao, China
Full manuscript Submission:
April 15, 2026
Acceptance Notification:
May 15, 2026
Camera-Ready Submission:
July 18, 2026
General Co-Chairs:
Junyu Dong, Ocean University of China
Songlin Sun, Beijing University of Posts and Telecommunications
Eryk Dutkiewicz, University of Technology Sydney
David Banjerdpongchai, Chulalongkorn University
Linh-Trung Nguyen, The University of Engineering and Technology - Vietnam National University
Technical Program Co-Chairs:
Celimuge Wu, The University of Electro-Communications
Jiaqi Zou, Tsinghua University
Qingming Huang, University of Chinese Academy of Science
Shiqi Wang, City University of Hong Kong
Local Arrangement Chairs:
Bohan Li, Ocean University of China
Secretary:
Zhilei Ling, Beijing University of Posts and Telecommunications
OFFICIAL WEBSITE
HTTPS://ISCIT2026.ORG
The 25th International Symposium on Communications and Information Technologies (ISCIT 2026) is a leading international conference dedicated to the in-depth exploration of the most recent advances, applications, and development findings in circuits, systems, Artificial Intelligence, information and communications technologies.
Under the theme "Building Smarter Connections for Tomorrow", the symposium will focus on how new communication technologies, smarter systems, and better ways to use information can help create a more connected and efficient world.
This symposium will include technical oral lectures and poster sessions, special sessions, live demonstrations and workshops on emerging topics, covering various topics in circuits and systems.
Prospective authors are invited to submit full-length, six-page manuscripts, including figures, tables, and references, to the official ISCIT 2026 website. All papers will be handled electronically. Accepted and presented papers will be included in the conference proceedings with ISBN and will be submitted for inclusion in IEEE Xplore®.